Dow is opening nominations for the 2023/2024 edition of its Packaging Innovation Awards (PIA), which focuses on recognising breakthroughs in technological advancement, sustainability and enhanced user experience.
The global program – now into its 35th edition – will be hosted by in Asia-Pacific this year for the first time with both the judging event and awards ceremony taking place in the region. Dow says this marks a milestone for the awards as it “continues its purpose of highlighting innovative packaging across industries and geographies”.
PIA claims to shine a spotlight on designs that “demonstrate what packaging can be when industry talent harnesses creativity and technology to solve contemporary challenges across the complete packaging value chain”. The 2022 edition drew 180 packaging submissions from 30 countries, and 28 packaging solutions were recognised.
This edition marks the beginning of a new biennial format, that provides a longer submission period, to give participants more time to collaborate with relevant partners on building a submission. Dow says the goal is to provide an accessible platform for a greater pool of packaging professionals to have their designs judged.
The submission period is now open, and closes on 8 March next year. Award finalists will be notified on 28 August, with the awards ceremony set to take place in Tokyo next October.
“Through the Packaging Innovation Award, we celebrate the best in packaging that meets protection, convenience and performance needs as well as being designed for sustainability. We continue to be inspired by the level of creativity and problem-solving each award uncovers, and we are looking forward to what this next edition brings,” said Karen Carter, president of Dow Packaging & Specialty Plastics.
“Given Asia-Pacific’s well-established role as the manufacturing hub of the world, there is no better time or place to shine a spotlight on and underscore the importance of packaging innovation and the impact on our lives today. With the enhanced biennial format and more multiple engagement points for participants, I look forward to seeing even more aspiring innovators rise to the mounting challenges faced by the packaging industry amidst ever-growing consumerism globally,” said David Luttenberger, the 2023 PIA jury chairperson, and global packaging director for Mintel Group.
General business entries for the 2023/2024 Packaging Innovation Awards can be submitted here. Entry in the competition is free, and applicants are not required to use Dow materials in their products.
